Paradise Valley, Arizona - December 2, 2025 -
Semiconductor manufacturer, IceMOS Technology Corporation, today announced a
significant expansion of its global footprint with the establishment of IceMOS
Technology Hong Kong Limited and the opening of new offices within the
prestigious Hong Kong Science Park. This strategic move provides robust
regional support for sales, field applications engineering and supply chain
management to meet the escalating demand for the company's advanced
semiconductor solutions in Asia and globally.
Advancing
Global Reach and Customer Support
The new IceMOS Hong Kong office will serve as a vital
regional hub, enhancing the company's ability to offer specialised technical
assistance and sales support, ensuring customers can effectively integrate
IceMOS's cutting-edge technologies into their products.
This expansion builds on momentum created by the company's
recent $22 Million Series E investment to fund the launch of its new Power
Semiconductor Device Technology, mSJMOS™.
IceMOS Technology is an industry-leading developer and
manufacturer of next-generation silicon power devices, utilising a novel
semiconductor technology based on over 70 patents of IceMOS Intellectual
Property.
The
company's core technologies include:
mSJMOS™ Power MOSFETs: A new class of silicon-based
power MOSFETs that integrate Silicon MEMS manufacturing techniques with mature
node CMOS Super-junction Power MOSFET structures; this novel approach results
in dramatic semiconductor energy efficiency and allows them to compete with
wideband gap devices at high voltages.
MEMS Sensor Solutions and Advanced Engineered Silicon
Substrates: Leveraging its manufacturing centre of excellence, IceMOS
develops and manufactures engineered silicon substrates and MEMS solutions for
sensing and advanced power applications. These specialised products provide the
fundamental platform for devices where power efficiency and sensing matters.
IceMOS's solutions are paving the way for more
energy-efficient and CO2-saving solutions that support decarbonisation.
Advanced technology is essential to serve the efficiency demands of massively
complex market segments, including:
·
Artificial Intelligence
(AI)
·
Internet of Things (IoT),
Big Data, and Data Centre Cloud/Edge Computing
·
Renewables (wind and solar)
and Photovoltaic Energy Generation
·
Electric Vehicles (EVs) and
EV Fast Charging
·
Aerospace Applications,
including Low Earth Orbit (LEO) satellites and deep space exploration
·
Applications requiring High
Reliable Power Supply Units: Aerospace, Industrial, Medical
Dr. Samuel J. Anderson, MBE, IceMOS Technology Founder
and Chairman, commented on the expansion: "The opening of our Hong
Kong office in the renowned Hong Kong Science Park marks an incredibly exciting
and significant step in our journey. Our sensing and power technologies are
driving the global demand for energy-efficient solutions. By establishing a
strong presence in Hong Kong, we are strategically positioned to enhance our
direct support for our international customers, expand our export footprint and
solidify our commitment to becoming the go-to provider for energy-efficient
semiconductor solutions worldwide."
Hugh Griffin, Chief Strategy Officer, IceMOS Technology, "Building
on our advanced export success, the Hong Kong office is the next essential step
in scaling our global reach, reinforcing our commitment to be the global
'go-to' provider for energy-efficient semiconductor solutions, and ensuring
world-class technical support where it matters most."
About
IceMOS Technology
IceMOS Technology, established in 2004, is an
equity-financed private Delaware semiconductor corporation and manufacturer of
Silicon MEMS based Power MOSFETs and Sensing Device technology. The technology
serves wide-ranging applications anywhere that power efficiency and sensing
matters. The company is headquartered in Paradise Valley, Arizona, with a
global operational footprint including a manufacturing centre of excellence
located in Belfast, Northern Ireland, an advanced research innovation centre in
Arizona, USA, a design centre in Tokyo, Japan, and sales and applications
support in Stuttgart, Germany, in addition to its new Hong Kong Science Park
office.
Company
and Media Contact:
Hugh Griffin
Chief Strategy Officer
IceMOS Technology
Email: hughgriffin@icemostech.com
