IceMOS Technology is a leading supplier of DSOI for a large range of IC and MEMS applications. With over 20 years experience in SOI manufacturing, we offer an impressive specification range, which is amongst the widest available in the market, ensuring that you receive the perfect DSOI solution for your application. We have extensive experience in SOI substrates and our applications engineering expertise can help you select the best combination of parameters to aid your processing when you get the DSOI wafers.
With a flexible approach, IceMOS allows the customer to grow from R&D production (offering small lots) to production. Our experienced MEMS process engineers have experience in optical, inertial, bio and other MEMS fields. IceMOS offer additional foundry processing for MEMS, trench, isolation, etc.
IceMOS DSOI wafers are used in the following applications:
SOI solutions for MEMS/MST
By making continuous improvements to our processes in a Lean Six Sigma environment, IceMOS Technology offer world class product quality, competitive cost structure plus rapid turnaround makes IceMOS Technology your ideal DSOI partner.