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Thick Film Bonded SOI Wafers

Request a quote Data Sheet  (pdf, 146kB)
SOI and Si-Si Direct Wafer Bonding Manufacturing

IceMos Technology is a leading supplier of thick-film SOI wafers for a large range of IC and MEMS applications. Our specification range is among the widest available to ensure you get the perfect SOI solution for your application. We have extensive experience in all types of SOI substrates and our applications engineering expertise on hand can help you select the best combination of parameters to aid your processing when you get the SOI wafers

Our SOI is widely used in the following applications

  • SOI solutions for MEMS/MST
  • RF MEMS and RF PIN diodes
  • Optoelectronics / micro-mirrors
  • Smart power
  • Solid State Relays
  • Integrated sensors
  • Advanced analog ICs

Sectos in which our SOI products are currently used

include : Telecommunications, Automotive, Entertainment, Medical, Instrumentation

Quality Assurance and Responsiveness

Operating in a ISO 9000:2000 compliant environment, we can satisfy your product quality requirements whether you are in an R&D phase and want rapid product turnaround or whether you are in volume production, requiring perfect on-time delivery performance as well as top quality products. Our customer support and applications engineering functions ensure your queries are answered promptly