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IceMos Technology can offer customers the benefit of years of deep silicon
trench etch and refill experience and expertise on both bulk silicon and on SOI
substrates. For customers who intend using SOI as a platform for dielectically
isolated circuits, IceMos uniquely can offer a one stop solution. Teaming our
high quality SOI wafers with our deep trench etch and refill capabilities, we
can offer such customers a product that will fit into their process flow at
active area definition, without the time consuming and costly processing
required to form the isolated tubs. Additionally, because we can add features
such as implanted buried layers next to the SOI interface and sidewall doping
as a low thermal budget sinker diffusion during our processing, this
potentially opens up possibilities that might otherwise not have been
considered. Because these technologies form part of our core competencies, it
frees the customer to concentrate on the active device rather than on the
isolation. (This product was formerly known as the BCO Substrate.)
For customers unfamiliar with Dielectric isolation as a means of high
performance Analog IC design, using the SOI plus trench + refill package from
IceMos Technology can not only offer higher performance, but lower cost due to
the die shrink possible when using trenches instead of area-hungry isolation
diffusions
Features
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Significant die shrink compared to conventional dielectric isolation (DI) or
junction isolation
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Bulk quality top silicon layer
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Total device-to-device isolation
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Lower substrate capacitance than bulk
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Fully flexible specification on SOI, Trench and refill parameters
Applications
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Photovoltaic cells and optoelectronic components
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Solid state relays
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High voltage analog circuits for telecommunications
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High temperature electronics
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High performance bipolar processes
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Smart power ICs
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Integrated sensors
Further Options
Let us take you Dielectrically isolated IC concept a stage further and let us
provide you with the full DI IC fabrication service. Using our Foundry partners
who have experience in processing SOI and dielctrically isolated wafers, we
can take your complete project and provide you with tested die instead of the
partially processed DI substrate.
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