SOI Substrates HomeRequest an online quotationGet a quotation for wafers currently in stock.SOI Substrates news
Home
SuperJunction
SOI Products
Quality Assurance
Technology
Wafer Bonding
Trench & Refill SOI
Technical Library
Glossary
News
Request a quote
SOI Inventory
Contact Us

Technology

Welcome to IceMos Technology's technology page. Here is where we tell you how we make our various products or at least an overview of the technology behind these. Please also use this as a guide to explore what we might be able to do for you, in the event that what you require does not conform exactly to one of our standard products. This technology tour takes you through our Fab and key pieces of equipment as well as what the state of the product is like at any particular stage. For those wishing a detailed scientific explanation of the physical processes at play in some of the key steps, the enclosed links will provide this. Enjoy learning about IceMosTechnology!

 

SOI and Si-Si Direct Wafer Bonding Manufacturing

 

Dielectric Isolated trench and refilled SOI wafer manufacturing

Overview of process technologies

IceMos Technology have a fully flexible manufacturing facility that can offer everything from prototyping new products to volume manufacturing. Everything you see here can be done on 100mm, 125mm, 150mm and 200mm wafers. This presents an ideal combination for customers with small diameter prototyping facilities and larger diameter production facilities. We can transfer seamlessly the technology used on your small diameter prototyping wafers to larger diameter wafers.