Technology
Welcome to IceMos Technology's technology page. Here is where we tell you how
we make our various products – or at least an overview of the technology behind
these. Please also use this as a guide to explore what we might be able to do
for you, in the event that what you require does not conform exactly to one of
our standard products. This technology tour takes you through our Fab and key
pieces of equipment as well as what the state of the product is like at any
particular stage. For those wishing a detailed scientific explanation of the
physical processes at play in some of the key steps, the enclosed links will
provide this. Enjoy learning about IceMosTechnology!
SOI and Si-Si Direct Wafer
Bonding Manufacturing
Dielectric Isolated trench
and refilled SOI wafer manufacturing
Overview of process technologies
IceMos Technology have a fully flexible manufacturing facility that can offer
everything from prototyping new products to volume manufacturing. Everything
you see here can be done on 100mm, 125mm, 150mm and 200mm wafers. This
presents an ideal combination for customers with small diameter prototyping
facilities and larger diameter production facilities. We can transfer
seamlessly the technology used on your small diameter prototyping wafers to
larger diameter wafers.
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